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Plating Thickness Measurement Machine XRF Analyzer Plating Thickness Measurement Machine XRF Analyzer
Plating Thickness Measurement Machine XRF Analyzer Plating Thickness Measurement Machine XRF Analyzer

Plating Thickness Measurement Machine XRF Analyzer

Thick800A incorporates in plating thickness measurement with full-auto software operation, multi-point testing, software controlling the instrument and movable platform. It is a powerful instrument equipped with special software and widely applied in plating industries.
  • ModelThick800A
  • BrandLABOAO
  • PortAny port in China
  • PackagePlywood case package
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DESCRIPTION

The instrument is specially designed for plating thickness measurement, rapid and non-destructive analysis for elements and contents of plating. Mainly applied in precious metal and jewelry processing industries; bank, jewelry selling and detection institution, electroplating industries.


Application

Detection for plating thickness of metals, content of plating solution and plating.

Detection for golden, platinum, silver, other precious metals and various jewelries content.

Mainly applied in precious metal and jewelry processing industries; bank, jewelry selling and detection institution, electroplating industries.

FEATURES

1. Top-lightening: Meet the requirement for testing samples of different thicknesses and irregular shapes.

2. Micro collimator: 0.1×1.0; can be used in testing micro point so as to improve testing accuracy.

3. Movable platform with high accuracy: Repeated location accuracy is less than 0.005mm and the test point can be precisely located.

4. Height laser: Auto height positioning ensures the testing for irregular samples, meanwhile protects the up & down platform.

5. Auto spot search: Precisely locates spot to make sure the test point is aligned to the spot.

6. Arbitrary measurement with mouse: Mouse can control the movable platform; it is able to click the test point by mouse. 

7. Detector with high resolution: improve analysis accuracy.

8. Safety: Excellent ray shielding; the test interface is protected by high sensitivity sensor.

SPECIFICATIONS

Model

Thick800A

Detection range for plating

25 elements such as Cr \Fe l Ni \Cu \Zn \Au \Ag \Pt \ Pd

Plating layers

5 layers

Stability

0.005~0.01μm

RSD

0.1%

Excellent repeatability

0.1%

Lon-time working stability

0.1%

Ambient temperature

15-15

Models

Arbitrary optional analysis and identification models;

Independent matrix effect correction models;

Multi-variable non-linear regression procedure;

Power supply

AC 220V+5V

CONFIGURATION LIST

1. Open sample chamber

2. High and low voltage power supply

3. Double-laser locating device

4. X-ray tube

5. Lead glass shield cover

6. Altitude transducer

7. Si-Pin detector

8. Protection transducer

9. Detect electronic circuit by signal

10. Computer and ink jet printer

11.  Precise 2-D movable sample platform. The detection system can lift up and down to realize 3-D movement.

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